Description
In recent years, the wireless industry has experienced enormous growth, leading a revolution in the technologies behind cell phones, personal digital assistants (PDA), handheld computers, etc. Devices that were once expensive, bulky and unreliable have become smaller, more efficient and affordable. Without ceramics, these devices we take for granted would not be possible. There are over 123 million wireless subscribers in the U.S.

Advanced ceramics are the basis for high-frequency capacitors and magnetic components that are used in these wireless devices. These components play an integral role in the miniaturization of wireless devices and in improving system performance. Ceramic substrates with embedded components, microwave multi-chip modules, and thermal management for high power consumption devices are critical to the newest generation of wireless devices that are internet-capable. These electronic ceramic materials combine high-speed and high-frequency performance to allow people to conveniently access data such as e-mail and up-to-date stock prices on their wireless devices.

The following individuals may be contacted by the media regarding ceramic applications in wireless technology.

Dr. Samuel Horowitz
Marketing Manger
E.I. DuPont
14TW Alexander Dr.
Research Triangle Park, NC 27709
919/248-5752 (phone)
919/248-5208 (fax)
samuel.j.horowitz@usa.dupont.com (e-mail)
Background: Horowitz has more than 25 years of experience in the ceramic packaging field with a focus on materials and applications for thick film and low-temperature cofired ceramics (LTCC) technologies. He is a founding member and past chair of the Ceramic Interconnect Initiative.

Dr. Michael Lanagan
Associate Professor; Associate Director, Materials Research Institute; Associate Director, Center for Dielectric Studies
Penn State University
258 Materials Research Laboratory Bldg.
University Park, PA 16802
814/865-6992 (phone)
814/865-2326 (fax)
mx146@psu.edu (e-mail)
Background: Lanagan's research group develops new materials with promising electrical properties and integration processes for use in future wireless applications that will incorporate greater levels of integration in terms of components, arrays, networks, modules and embedded components.

Dr. David Wilcox
Director of Micro-Technologies Research Lab
Motorola Labs
7700 S. River Parkway
Tempe, AZ 85248
480/755-6016 (phone)
480/755-5531 (fax)
david.l.wilcox@motorola.com (e-mail)
Background: Wilcox pioneered the development of and early use of the high-temperature multilayer ceramics (HTCC) as an interconnect packaging technology for IBM's high end computer systems. He also led the introduction of the use of the low-temperature multilayer ceramics (LTCC) for integration of the RF functions for Motorola wireless applications and is currently pioneering the morphing of the LTCC into a microsystem technology as a platform for the 3D integration of electronics, fluidics, thermonics and photonics which will enable microreactor, lab-on-chip and SIP applications.