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Contact: IMAPS: Ann Bell, abell@imaps.org, 202-548-8717 ACerS: Aimée F. Zerla, azerla@ceramics.org, 614-794-5893 May 14, 2004 |
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IMAPS and ACerS to Co-Sponsor 2005 Ceramic Conference |
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WESTERVILLE, OHIO — The International Microelectronic and Packaging Society (IMAPS) and The American Ceramic Society (ACerS) announce an agreement to jointly sponsor The International Conference on Ceramic Interconnect and Ceramic Microsystems Technology. This conference will be an expanded version of IMAPS’ long-running and successful annual Ceramic Interconnect Conference. IMAPS and ACerS technical leaders have teamed very successfully the past two years paving the way for this expanded commitment to grow the impact of ceramic interconnect and ceramic microsystems technologies by the two Societies. In 2005, the conference will be held April 11-13, in Baltimore, Md., at the Marriott Waterfront Hotel, in conjunction with the ACerS Annual Meeting. In 2006 and beyond, the conference will be held annually each spring as an independent event, or in conjunction with another technical meeting. This partnership between IMAPS and ACerS combines the applications, development, and marketing strengths of the IMAPS membership, with the fundamental materials and process development strengths of the ACerS membership to focus on two of the fastest growing areas of ceramic technology. Three-dimensional (3-D) ceramic structures such as those enabled by low temperature co-fired ceramic (LTCC) materials and processes, together with embedded components and functional integration, have created new generations of miniaturized, wireless devices. These capabilities, combined with the emerging ability to embed microchannels and to create shaped surfaces, are enabling new microfluidic technology microsystem level applications. Micro-energy, micro-reactor, photonic, and sensor-based applications will exploit the dimensional regime, thermal robustness, chemical durability, and total system cost advantages of these advanced ceramic technologies. By combining the strengths of their global communities, IMAPS and ACerS expect to accelerate the development and use of ceramic interconnect and ceramic microsystems technology. The General Co-Chairs for the 2005 conference are Dr. Samuel J. Horowitz (DuPont) and Dr. David Wilcox (Consultant). The technical Co-Chairs are Mike Ehlert (Consultant) and Dr. Kevin Ewsuk (Sandia National Laboratories). Additionally, an international advisory board of distinguished scientists and engineers has been assembled to assist in organizing the technical program. More than 250 attendees are expected to participate in the three-day, 2005 International Conference on Ceramic Interconnect and Ceramic Microsystems Technology. The technical program will include 60-80 papers focusing on the technological advances, applications, and markets that are uniquely satisfied by these advanced ceramic technologies. Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. In addition, the IMAPS Sidney J. Stein Educational Foundation provides annual grants to students involved in electronic packaging disciplines. The American Ceramic Society is an international association of scientists, engineers, industrialists, potters, and artists who are active in the creation of new products, applications, and research regarding ceramics and related materials. ACerS serves more than 8,000 members and 50,000 subscribers in 80 countries with books, periodicals, meetings, expositions, and online technical information. |
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